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EMC2302 Datasheet(PDF) 56 Page - Microchip Technology |
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EMC2302 Datasheet(HTML) 56 Page - Microchip Technology |
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56 / 70 page ![]() EMC2301/2/3/5 DS20006532A-page 56 2021 Microchip Technology Inc. Microchip Technology Drawing C04-021D Sheet 2 of 2 10-Lead Plastic Micro Small Outline Package (MS) [MSOP] For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: REF: Reference Dimension, usually without tolerance, for information purposes only. 3. BSC: Basic Dimension. Theoretically exact value shown without tolerances. 1. Notes: 2. Pin 1 visual index feature may vary, but must be located within the hatched area. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or Dimensioning and tolerancing per ASME Y14.5M. protrusions shall not exceed 0.15mm per side. L1 Footprint Mold Draft Angle Lead Width Lead Thickness c b Dimension Limits Overall Height Molded Package Thickness Molded Package Width Overall Length Foot Length Standoff Overall Width Number of Pins Pitch A L E1 D A1 E A2 e N Units 0.95 REF - - 0.08 0.15 0.23 0.33 MILLIMETERS 0.50 BSC 0.85 3.00 BSC 3.00 BSC 0.60 4.90 BSC 0.40 0.00 0.75 MIN NOM 1.10 0.80 0.15 0.95 MAX 10 - -- 8° 0° - C SEATING PLANE L (L1) c DETAIL A Foot Angle - 15° 5° 1 4X 1 4X 1 |
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