1.2

SiC Schottky Diode Ratings and Characteristics (Per SiC Diode)

The following table lists the SiC diode ratings and characteristics per SiC diode of MSCSM170HM23CT3AG device.

Table 1-5. SiC Schottky Diode Ratings and Characteristics

Symbol

Characteristic

Test Conditions

Min

Typ

Max

Unit

Peak repetitive reverse voltage

—

—

1700

V

Reverse leakage current

—

20

400

µA

—

300

—

DC forward current

—

—

60

—

A

Diode forward voltage

—

1.5

1.8

V

—

2.3

—

Total capacitive charge

—

460

—

nC

C

Total capacitance

—

334

—

pF

—

276

—

Junction-to-case thermal resistance

—

—

0.276

°C/W

1.3

Thermal and Package Characteristics

The following table lists the thermal and package characteristics of the MSCSM170HM23CT3AG device.

Table 1-6. Thermal and Package Characteristics

Symbol

Characteristics

Min

Max

Unit

RMS isolation voltage, any terminal to case t =1 min, 50 Hz/60 Hz 4000

—

V

Operating junction temperature range

–40

175

°C

Recommended junction temperature under switching conditions

–40

25

Storage temperature range

–40

125

Operating case temperature

–40

125

Torque

Mounting torque

To heatsink

M4

2

3

N.m

Wt

Package weight

—

110

g

MSCSM170HM23CT3AG

Electrical Specifications

Datasheet

DS00003953A-page 5