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FDPC8016S Datasheet(PDF) 3 Page - ON Semiconductor |
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FDPC8016S Datasheet(HTML) 3 Page - ON Semiconductor |
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3 / 12 page ![]() FDPC8016S www.onsemi.com 2 PINOUT DESCRIPTION Pin Name Description Pin Name Description Pin Name Description 1 HSG High Side Gate 3. 4, 10 V+(HSD) High Side Drain 8 LSG Low Side Gate 2 GR Gate Return 5, 6, 7 SW Switching Node, Low Side Drain 9 GND(LSS) Low Side Source MOSFET MAXIMUM RATINGS (TA = 25°C, Unless otherwise specified) Symbol Parameter Q1 Q2 Unit VDS Drain to Source Voltage 25 (Note 5) 25 (Note 5) V VGS Gate to Source Voltage ±12 ±12 V ID Drain Current Continuous (TC = 25°C) Continuous (TA = 25°C) Pulsed (TA = 25°C) (Note 4) 60 20 (Note 1a) 75 100 35 (Note 1b) 140 A EAS Single Pulsed Avalanche Energy (Note 3) 73 216 mJ PD Power Dissipation for Single Operation (TC = 25°C) (TA = 25°C) 21 2.1 (Note 1a) 42 2.3 (Note 1b) W TJ, TSTG Operating and Storage Junction Temperature Range −55 to +150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Symbol Parameter Q1 Q2 Unit RqJC Thermal Resistance, Junction to Case 6.0 3.0 _C/W RqJA Thermal Resistance, Junction to Ambient 60 (Note 1a) 55 (Note 1b) _C/W RqJA Thermal Resistance, Junction to Ambient 130 (Note 1c) 120 (Note 1d) _C/W PACKAGE MARKING AND ORDERING INFORMATION Device Marking Device Package Reel Size Tape Width Quantity 05OD/15OD FDPC8016S Power Clip 56 13″ 12 mm 3,000 Units ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Symbol Parameter Test Conditions Type Min Typ Max Unit OFF CHARACTERISTICS BVDSS Drain to Source Breakdown Voltage ID = 250 μA, VGS = 0 V ID = 1 mA, VGS = 0 V Q1 Q2 25 25 − − − − V DBVDSS/DTJ Breakdown Voltage Temperature Coefficient ID = 250 μA, referenced to 25°C ID = 10 mA, referenced to 25°C Q1 Q2 − − 24 28 − − mV/_C IDSS Zero Gate Voltage Drain Current VDS = 20 V, VGS = 0 V VDS = 20 V, VGS = 0 V Q1 Q2 − − − − 1 500 mA IGSS Gate to Source Leakage Current, Forward VGS = 12 V / −8 V, VDS= 0 V VGS = 12 V / −8 V, VDS= 0 V Q1 Q2 − − − − ±100 ±100 nA nA ON CHARACTERISTICS VGS(th) Gate to Source Threshold Voltage VGS = VDS, ID = 250 μA VGS = VDS, ID = 1 mA Q1 Q2 0.8 1.0 1.3 1.5 2.5 2.5 V DVGS(th)/DTJ Gate to Source Threshold Voltage Temperature Coefficient ID = 250 μA, referenced to 25°C ID = 10 mA, referenced to 25°C Q1 Q2 − − −4 −3 − − mV/_C |
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