EMIF08-VID01C2 datasheet(4/6 Pages) STMICROELECTRONICS

4 / 6 page

2 Ordering information scheme

EMIF08-VID01C2

4/6

Ordering information scheme

Package mechanical data flip chip

Figure 7.

Marking

Figure 8.

Foot print receommendation

EMI Filter

Number of lines

X: resistance (Ohms)

Z: capacitance value / 10 pF

Application (3 letters) and

Version (2 digits)

C: Coated flip chip

1: Pitch = 500 µm, Bump = 315 µm

2: Lead free Pitch = 500 µm, Bump = 315 µm

EMIF

xxx zz

695µm +/- 70

3.92 mm +/-50µm

500µm +/-50

315 µm +/- 50

250µm +/-50

695µm +/- 70

3.92 mm +/-50µm

500µm +/-50

315 µm +/- 50

250µm +/-50

3.92 mm +/-50µm

500µm +/-50

315 µm +/- 50

250µm +/-50

xx z

y ww

xx z

y ww

240

365

xx z

y ww

Dot, ST Logo

xx = marking

z = packaging

location

yww = date code

Dimensions in

Copper pad Diameter :

250µm recommended , 300µm max

Solder stencil opening : 330µm

Solder mask opening recommendation :

340µm min for 300µm copper pad diameter

Copper pad Diameter :

250µm recommended , 300µm max

Solder stencil opening : 330µm

Solder mask opening recommendation :

340µm min for 300µm copper pad diameter

EMIF08-VID01C2 Datasheet(PDF) 4 Page - STMicroelectronics

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