14

UCD9501

Digital

1

12

8

PVDD

OUT

CS

10

PGND

3

4

2

5

6

3V3

AGND

IN

CLF

ILIM

7

UCD7100PWP

VOUT

VDS

CS

FB

CS

VDS

COMMUNICATION

(Programming & Status Reporting)

Bias

Supply

11

OUT

9

PGND

13

PVDD

VDD

NC

Signal

Conditioning

Amplifier

~

~

+

−

VAC

PFC_ISENSE

Signal

Conditioning

Amplifier

Controller

Figure 12-2. PFC Boost Front-End Power Supply

12.3 Thermal Considerations

The useful range of a driver is greatly affected by the drive power requirements of the load and the thermal

characteristics of the device package. In order for a power driver to be useful over a particular temperature range

the package must allow for the efficient removal of the heat produced while keeping the junction temperature

within rated limits. The UCD7K family of drivers is available in PowerPAD™ TSSOP package to cover a range

of application requirements. Both have the exposed pads to relieve thermal dissipation from the semiconductor

junction.

As illustrated in Reference [2], the PowerPAD™ packages offer a leadframe die pad that is exposed at the

base of the package. This pad is soldered to the copper on the PC board (PCB) directly underneath the device

vias to complete the heat removal subsystem, as summarized in Reference [3].

Note that the PowerPAD™ is not directly connected to any leads of the package. However, it is electrically and

thermally connected to the substrate which is the ground of the device.

www.ti.com

UCD7100

SLUS651E – MARCH 2005 – REVISED NOVEMBER 2021

Copyright © 2021 Texas Instruments Incorporated

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