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STM32G0 Datasheet(PDF) 110 Page - STMicroelectronics |
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STM32G0 Datasheet(HTML) 110 Page - STMicroelectronics |
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110 / 135 page ![]() Package information STM32G071x8/xB 110/135 DS12232 Rev 4 Device marking The following figure gives an example of topside marking orientation versus ball A1 identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks that identify the parts throughout supply chain operations, are not indicated below. Figure 34. WLCSP25 package marking example 1. Parts marked as ES or E or accompanied by an Engineering Sample notification letter are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST's Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. Table 75. Recommended PCB pad design rules for WLCSP25 package Dimension Recommended value (mm) Pitch 0.4 Dpad 225 Dsm 0.290 typ.(1) 1. Depends on the solder mask registration tolerance Stencil opening 0.250 Stencil thickness 0.100 MSv47937V2 Product identification (1) Date code Revision code G0786 R YWW Ball A1 identifier |
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