MIC2033 datasheet(14/28 Pages) MICROCHIP

14 / 28 page

MIC2033

DS20005539C-page 14

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2018 - 2022 Microchip Technology Inc. and its subsidiaries.

4.7

Thermal Measurements

It is always wise to measure the IC’s case temperature

to make sure that it is within its operating limits.

Although this might seem like a very elementary task, it

is very easy to get erroneous results. The most

common mistake is to use the standard thermal couple

that comes with the thermal voltage meter. This thermal

couple wire gauge is large, typically 22 gauge, and

behaves like a heatsink, resulting in a lower case

measurement.

There are two suggested methods for measuring the IC

case temperature: a thermal couple or an infrared

thermometer. If a thermal couple is used, it must be

constructed of 36 gauge wire or higher to minimize the

wire heatsinking effect. In addition, the thermal couple

tip must be covered in either thermal grease or thermal

glue to make sure that the thermal couple junction is

making good contact to the case of the IC. This thermal

couple from Omega (5SC-TT-K-36-36) is adequate for

most applications.

To avoid this messy thermal couple grease or glue, an

infrared thermometer is recommended. Most infrared

thermometers’ spot size is too large for an accurate

reading on small form factor ICs. However, an IR

thermometer from Optris has a 1 mm spot size, which

makes it ideal for the 2 mm x 2 mm DFN package. Also,

get the optional stand. The stand makes it easy to hold

the beam on the IC for long periods of time.

MIC2033 Datasheet(PDF) 14 Page - Microchip Technology