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STM32F051X4 Datasheet(PDF) 91 Page - STMicroelectronics |
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STM32F051X4 Datasheet(HTML) 91 Page - STMicroelectronics |
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91 / 122 page  DocID022265 Rev 7 91/122 STM32F051x4 STM32F051x6 STM32F051x8 Package information 115 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 7.1 UFBGA64 package information UFBGA64 is a 64-ball, 5 x 5 mm, 0.5 mm pitch ultra-fine-profile ball grid array package. Figure 34. UFBGA64 package outline 1. Drawing is not to scale. Table 65. UFBGA64 package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.460 0.530 0.600 0.0181 0.0209 0.0236 A1 0.050 0.080 0.110 0.0020 0.0031 0.0043 A2 0.400 0.450 0.500 0.0157 0.0177 0.0197 A3 0.080 0.130 0.180 0.0031 0.0051 0.0071 A4 0.270 0.320 0.370 0.0106 0.0126 0.0146 |
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