STPS2H100_V01 datasheet(5/19 Pages) STMICROELECTRONICS

5 / 19 page

Figure 11. Junction capacitance versus reverse voltage

applied (typical values)

100

1 0

100

C(pF)

V ( V)

F= 1MHz

= 30mV

T = 25°C

OSC

RMS

Figure 12. Forward voltage drop versus forward current

(low level)

I (A)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

Tj=25°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Typical values)

Tj=125°C

(Typical values)

V (V)

Figure 13. Forward voltage drop versus forward current

(high level)

I (A)

100

0.4 0.5

0.6 0.7 0.8 0.9

1.0 1.1 1.2

1.3 1.4 1.5 1.6

1.7 1.8

Tj=25°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Typical values)

Tj=125°C

(Typical values)

V (V)

Figure 14. Thermal resistance junction to ambient versus

copper surface under each lead (SMA)

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

(°C/W)

th(j-a)

SMA

S(Cu)(cm²)

Epoxy printed circuit board FR4, copper thickness: 35 µm

Figure 15. Thermal resistance junction to ambient versus

copper surface under each lead (SMA Flat, SMA Flat

Notch)

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

(°C/W)

th(j-a)

S(Cu)(cm²)

Epoxy printed circuit board FR4, copper thickness: 35 µm

SMA Flat Notch

SMA Flat

Figure 16. Thermal resistance junction to ambient versus

copper surface under each lead (SMB)

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

(°C/W)

th(j-a)

SMB

S(Cu)(cm²)

Epoxy p ri nted ci rcuit board FR4, coppe r t hickness: 35 µm

STPS2H100

Characteristics (curves)

DS1452 - Rev 10

page 5/19

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