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STTH30L06-Y Datasheet(PDF) 6 Page - STMicroelectronics |
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STTH30L06-Y Datasheet(HTML) 6 Page - STMicroelectronics |
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6 / 13 page ![]() Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (typical values) R (°C/W) th(j-a) 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 S (cm²) CU Epoxy printed circuit board FR4, copper thickness = 35 µm STTH30L06-Y Characteristics (curves) DS7255 - Rev 3 page 6/13 |
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