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TLE9012DQU Datasheet(PDF) 13 Page - Infineon Technologies AG |
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TLE9012DQU Datasheet(HTML) 13 Page - Infineon Technologies AG |
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13 / 76 page ![]() 3.3 Thermal resistance Table 3 Thermal resistance VVS = VVS_functional, Tj = -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless otherwise specified) Parameter Symbol Values Unit Note or condition P- Number Min. Typ. Max. Junction to case RthJC – 6 – K/W 4) PRQ-522 Junction to ambient RthJA – 30 – K/W 4)5) PRQ-523 4 Not subject to production test, specified by design. 5 Specified RthJA value is according to JEDEC JESD51-5,-7 at natural convection on FR4 2s2p board; The product (chip and package) was simulated on a 76.2 × 114.3 × 1.5 mm board with 2 inner copper layers (2 × 70 µm Cu, 2 × 35 µm Cu). The thermal via array under the exposed pad consists of 16 vias with a diameter of 0.3 mm and a plating thickness of 25 µm. TLE9012DQU Li-ion battery monitoring and balancing IC 3 General product characteristics Datasheet 13 Rev. 1.0 2022-01-24 |
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