AD9772A-EB datasheet(9/40 Pages) AD

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AD9772A

Rev. C | Page 9 of 40

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

With Respect to

Rating

AVDD, DVDD, CLKVDD,

PLLVDD

ACOM, DCOM,

CLKCOM, PLLCOM

−0.3 V to +4.0 V

AVDD, DVDD, CLKVDD,

PLLVDD

AVDD, DVDD,

CLKVDD, PLLVDD

−4.0 V to +4.0 V

ACOM, DCOM,

CLKCOM, PLLCOM

ACOM, DCOM,

CLKCOM, PLLCOM

−0.3 V to +0.3 V

REFIO, REFLO, FSADJ,

SLEEP

ACOM

−0.3 V to

AVDD + 0.3 V

IOUTA, IOUTB

ACOM

−1.0 V to

AVDD + 0.3 V

DB0 to DB13, MOD0,

MOD1, PLLLOCK

DCOM

−0.3 V to

DVDD + 0.3 V

CLK+, CLK−

CLKCOM

−0.3 V to

CLKVDD + 0.3 V

DIV0, DIV1, RESET

CLKCOM

−0.3 V to

CLKVDD + 0.3 V

LPF

PLLCOM

−0.3 V to

PLLVDD + 0.3 V

Junction Temperature

125°C

Storage Temperature

−65°C to +150°C

Lead Temperature

(10 sec)

300°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL CHARACTERISTICS

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 7. Thermal Resistance

Package Type

θJA

θJC

Unit

48-Lead LQFP

°C/W

ESD CAUTION

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