SUPSW, HVEN to PGND......................................-0.3V to +40V

BIAS to Ground ....................................................-0.3V to +6.0V

G_DMOS to Ground...........................................-0.3V to +16.0V

AGND to PGND....................................................-0.3V to +0.3V

PV to PGND ..........................................................-03V to +6.0V

BST to LX.............................................................-0.3V to +6.0V

HVDP1, HVDP2, HVPM1, HVDM2 to Ground......-0.3V to +18V

LX Continuous Current............................................................8A

(Single-Layer Board

derate 13.2mW/°C over +70°C) .............................1052.6mW

Operating Temperature Range......................... -40°C to +125°C

Maximum Junction Temperature .....................................+150°C

Storage Temperature Range..............................-60°C to+150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow).......................................+260°C

FC2-QFN

(Note 1)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage Range

3.5

36

V

Load-Dump-Event Supply

Voltage

40

V

Shutdown Supply Current

off state

6

15

µA

BIAS Regulator Voltage

(Nominal)

4.7

4.96

5.45

V

BIAS Undervoltage Lockout

(Rising)

2.7

3

3.3

V

BIAS Undervoltage Lockout

(Falling)

2.5

V

BIAS Current Limit

50

mA

PACKAGE TYPE

PACKAGE CODE

OUTLINE NO.

LAND PATTERN NO.

20 FC2-QFN

F203A5F+1

21-100124

90-100045

Note 1: Thermal resistance can be lowered with improved board design.

Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics

Electrical Characteristics

Package Information

For the latest package outline information and land patterns (footprints), go to

www.maximintegrated.com/packages. Note that a “+”,

“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing

pertains to the package regardless of RoHS status.

MAX20047

Dual 3A USB DCP Charger

www.maximintegrated.com

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