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IRFBE30LPBF Datasheet(PDF) 1 Page - Vishay Siliconix |
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IRFBE30LPBF Datasheet(HTML) 1 Page - Vishay Siliconix |
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1 / 11 page ![]() IRFBE30S, SiHFBE30S, IRFBE30L, SiHFBE30L www.vishay.com Vishay Siliconix S21-0943-Rev. D, 20-Sep-2021 1 Document Number: 91119 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Power MOSFET FEATURES • Dynamic dV/dt rating • Repetitive avalanche rated • Fast switching • Ease of paralleling • Simple drive requirements • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 Note * This datasheet provides information about parts that are RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details DESCRIPTION Third generation power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. Note a. See device orientation Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11) b. VDD = 50 V, starting TJ = 25 °C, L = 29 mH, Rg = 25 , IAS = 4.1 A (see fig. 12) c. ISD 4.1 A, dI/dt 100 A/μs, VDD 600 V, TJ 150 °C d. 1.6 mm from case PRODUCT SUMMARY VDS (V) 800 RDS(on) ()VGS = 10 V 3.0 Qg max. (nC) 78 Qgs (nC) 9.6 Qgd (nC) 45 Configuration Single N-Channel MOSFET G D S D2PAK (TO-26 G D S I2PAK (TO-262) G D S Available Available ORDERING INFORMATION Package D2PAK (TO-263) D2PAK (TO-263) I2PAK (TO-262) Lead (Pb)-free and Halogen-free SiHFBE30S-GE3 SiHFBE30STRL-GE3 a SiHFBE30L-GE3 Lead (Pb)-free IRFBE30SPbF IRFBE30STRLPbF a IRFBE30LPbF ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted) PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage VDS 800 V Gate-Source Voltage VGS ± 20 Continuous Drain Current VGS at 10 V TC = 25 °C ID 4.1 A TC = 100 °C 2.6 Pulsed Drain Current a IDM 16 Linear Derating Factor 1.0 W/°C Single Pulse Avalanche Energy b EAS 260 mJ Avalanche Current a IAR 4.1 A Repetitive Avalanche Energy a EAR 13 mJ Maximum Power Dissipation TC = 25 °C PD 125 W Peak Diode Recovery dV/dt c dV/dt 2.0 V/ns Operating Junction and Storage Temperature Range TJ, Tstg -55 to +150 °C Soldering Recommendations (Peak temperature) d for 10 s 300 Mounting Torque 6-32 or M3 screw 10 lbf · in 1.1 N · m |
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