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MPC8250ACVVCPMX Datasheet(PDF) 13 Page - NXP Semiconductors |
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MPC8250ACVVCPMX Datasheet(HTML) 13 Page - NXP Semiconductors |
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13 / 62 page  MPC8250 Hardware Specifications, Rev. 2 Freescale Semiconductor 13 Electrical and Thermal Characteristics Note that although the specifications generally reference the rising edge of the clock, the following AC timing diagrams also apply when the falling edge is the active edge. Figure 3 shows the FCC external clock. Figure 3. FCC External Clock Diagram sp20 sp21 TDM inputs/SI 15 12 12 10 sp18a sp19a SCC/SMC/SPI/I2C inputs—internal clock (NMSI) 20 16 0 0 sp18b sp19b SCC/SMC/SPI/I2C inputs—external clock (NMSI) 5 4 5 4 sp22 sp23 PIO/TIMER/IDMA inputs 10 8 3 3 1 Input specifications are measured from the 50% level of the signal to the 50% level of the rising edge of CLKIN. Timings are measured at the pin. Table 8. AC Characteristics for CPM Inputs 1 Spec Number Characteristic Setup (ns) Hold (ns) Max Min 66 MHz 83 MHz 66 MHz 83 MHz Serial ClKin FCC input signals FCC output signals FCC output signals Note: When GFMR[TCI] = 1 Note: When GFMR[TCI] = 0 sp16b sp17b sp36b/sp37b sp36b/sp37b |
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