6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage

6

V

–42

42

V

GND – 0.3

42

ENABLE

GND – 0.3

6

V

REF, OUT(3)

GND – 0.3

V

Input current into any pin(3)

5

mA

Operating temperature

–55

150

°C

Junction temperature

150

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

(3)

Input voltage at any pin may exceed the voltage shown if the current at that pin is limited to 5 mA.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±3000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Common-mode input range

GND – 0.2

40

V

Input pin voltage range

GND – 0.2

40

V

Operating supply voltage

1.7

5.5

V

Reference pin voltage range

GND

V

Operating free-air temperature

–55

150

°C

6.4 Thermal Information

THERMAL METRIC(1)

INA190EP

UNIT

DDF (SOT23)

8 PINS

Junction-to-ambient thermal resistance

164.6

°C/W

Junction-to-case (top) thermal resistance

86.6

°C/W

Junction-to-board thermal resistance

84.3

°C/W

Junction-to-top characterization parameter

7.1

°C/W

Junction-to-board characterization parameter

83.8

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

INA190-EP

SBOSA74 – MAY 2022

www.ti.com

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