LMK6C datasheet(20/45 Pages) TI

20 / 45 page

11 Power Supply Recommendations

For the best electrical performance of the LMK6x, TI recommends using a combination of 10 µF, 1 µF, and

0.1 µF on its power supply bypass network. TI also recommends using component side mounting of the

power-supply bypass capacitors, and it is best to use 0201 or 0402 body size capacitors to facilitate signal

routing. Keep the connections between the bypass capacitors and the power supply on the device as short as

possible. Ground the other side of the capacitor using a low impedance connection to the ground plane.

12 Layout

12.1 Layout Guidelines

The following sections provides recommendations for board layout, solder reflow profile and power-supply

bypassing when using the LMK6x to ensure good thermal and electrical performance and signal integrity of the

entire system.

12.1.1 Ensuring Thermal Reliability

The LMK6x is a high-performance device. Therefore, pay careful attention to device configuration and printed

circuit board (PCB) layout with respect to power consumption. The ground pin must be connected to the ground

plane of the PCB through three vias or more, as shown in Figure 12-1, to maximize thermal dissipation out of the

package.

The equation below describes the relationship between the PCB temperature around the LMK6x and its junction

temperature.

TB = TJ – ΨJB × P

(1)

where

• TB: PCB temperature around the LMK6x

• TJ: Junction temperature of LMK6x

• ΨJB: Junction-to-board thermal resistance parameter of LMK6x (refer to the Thermal Information tables in the

Specifications section for this information)

• P: On-chip power dissipation of LMK6x

LMK6C

SNAS826A – APRIL 2022 – REVISED JULY 2022

www.ti.com

Submit Document Feedback

Product Folder Links: LMK6C

LMK6C Datasheet(PDF) 20 Page - Texas Instruments