DS0147 datasheet(117/128 Pages) MICROCHIP

117 / 128 page

Unit

Max

Typ

Min

Power-On (Cold) Reset

to Fabric and I/O Oper-

ational

7.89

4.43

0.97

Time when output pins

start driving – TOUT_ACTI-

VE(cold)

6.10.6

Warm Reset to Fabric and I/Os (Low Speed) Functional

The following table specifies the minimum, typical, and maximum times from the negation of the warm

reset event until the FPGA fabric is operational and the FPGA IOs are functional for low-speed (sub-400

MHz) operation.

Table 147 • Warm Boot

Unit

Max

Typ

Min

Warm Reset to Fabric

and I/O Operational

2.62

1.63

0.65

Time when input pins

start working – TIN_ACTIV-

E(warm)

2.62

1.63

0.65

Time when weak pull-

ups/pull-downs are en-

abled – TPU_PD_ACTIVE-

(warm)

2.65

1.66

0.68

Time when fabric is op-

erational – TFAB_READY-

(warm)

2.67

1.68

0.70

Time when output pins

start driving – TOUT_ACTI-

VE(warm)

6.10.7

Miscellaneous Initialization Parameters

In the following table, TFAB_READY refers to either TFAB_READY(cold) or TFAB_READY(warm) as specified in the previous

tables, depending on whether the initialization is occurring as a result of a cold or warm reset, respectively.

Table 148 • Cold and Warm Boot

Condition

Unit

Max

Typ

Min

Symbol

Parameter

The time from

TFAB_READY to

ready to pro-

gram through JT-

AG/SPI-Slave

TPUF_OVHD

The time from

TFAB_READY to au-

to-update start

TPUF_OVHD

The time from

TFAB_READY to

programming

recovery start

113

Microsemi Proprietary and Confidential. DS0147 Revision 1.0

AC Switching Characteristics

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