L6364 datasheet(54/60 Pages) STMICROELECTRONICS

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Revision history

Table 36. Document revision history

Date

Version

Changes

11-Aug-2020

Initial release.

21-Oct-2020

Replaced Figure 1, Figure 2, Section 21 , Section 21 , Figure 20, Figure 21

and Figure 22 added Figure 23 and Figure 24.

30-Jul-2021

Added CSP information: front page, package pin-out and pin description

Section 3 , thermal data Section 4.2 , mechanical drawings Section 24 and

packing information Section 24 .

Added the maximum value for CDOUT Section 4.3 .

Wake-up detection: changed NRETRY to NSHORT symbol in Table 6

Section 4.4 ; added Figure 3 and rephrased chapter 9 Section 10 .

Surge protection: reworked information in Table 9 Section 4.4 with

VSURGE(LEAKAGE) and VSURGE(THRESHOLD) parameters.

Reworked register map style of Table 32 Section 21 .

25-Oct-2021

In front page, added packing information in Product summary table.

Extended product description and moved from front page to chapter 1.

Deleted VDCDC_3V3_MIN from Table 4. Recommended operating conditions.

Added note about VDIG voltage rail compatibility in table Section 3 Package

and pin-out and in Section 6 SPI Communication.

Added RTH(JA) in JEDEC conditions in Section 4.2 Thermal Characteristics.

Rephrased description of Join and DIO modes in chapter 6 Section 7 DIO

pin.

Rephrased chapters Section 8.1.8 Interrupt handler structure and

Section 8.2.2 Receive mode

Fixed input voltage value in Section 17.2 Converter architecture.

Updated chapter Section 19 Power dissipation and Figure 18. Example of

thermal power dissipation estimation.

Updated packing information of QFN20L (Figure 27. QFN20L, Packing

information (drawing and dimension [mm])) and CSP19 (Section 24 ).

L6364

DS13363 - Rev 4

page 54/60

L6364 Datasheet(PDF) 54 Page - STMicroelectronics