ACEPACK SMIT

1

6

4

3

9

8

7

1

3

4

6

9

8

7

9 (DC+)

7 (U)

8 (DC-)

1 (GHS)

2 (KHS)

3, 4 (NC)

6 (GLS)

5 (KLS)

GADG060720221002SA

Features

Order code

SH68N65DM6AG

650 V

41 mΩ

64 A

•

AQG 324 qualified

•

Half-bridge power module

•

650 V blocking voltage

•

Fast recovery body diode

•

Very low switching energies

•

Low package inductance

•

Dice on direct bond copper (DBC) substrate

•

Low thermal resistance

•

Isolation rating of 3.4 kVrms/min

Applications

•

Switching applications

Description

This device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT

is a very compact and rugged power module in a surface mount package for easy

assembly. Thanks to the DBC substrate, the ACEPACK SMIT package offers low

thermal resistance coupled with an isolated top-side thermal pad. The high design

flexibility of the package enables several configurations, including phase legs, boost,

and single switch through different combinations of the internal power switches.

Product status link

SH68N65DM6AG

Product summary

Order code

SH68N65DM6AG

Marking

H68N65DM6

Package

ACEPACK SMIT

Packing

Tape and reel

Automotive-grade N-channel 650 V, 35 mΩ typ., 64 A MDmesh DM6 half-bridge

topology Power MOSFET in an ACEPACK SMIT package

SH68N65DM6AG

Datasheet

DS14027 - Rev 1 - July 2022

For further information contact your local STMicroelectronics sales office.

www.st.com