ACS102-6T

4 Package information

9/11

4.2

SO-8 Mechanical data

Figure 18. SO-8 Footprint

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect . The category of

second level interconnect is marked on the package and on the inner box label, in compliance

with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also

marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are

available at: www.st.com.

REF.

DIMENSIONS

Millimetres

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A

1.350

1.75

0.053

0.069

A1

0.100

0.250 0.004

0.010

A2

1.100

1.650 0.043

0.065

B

0.330

0.510 0.013

0.020

C

0.190

0.250 0.008

0.010

D

4.800

5.000 0.189

0.197

E

3.800

4.000 0.150

0.157

e

1.270

0.050

H

5.800

6.200 0.228

0.244

h

0.250

0.500 0.010

0.020

L

0.400

1.270 0.016

0.050

k0°

8°

0°

8°

ddd

0.100

0.004

E

D

8

4

1

5

H

k

h x 45°

L

C

(Seating

Plane)

0.25mm

(Gage Plane)

e

A

A2

B

A1

ddd C

6.8

4.2

1.27

0.6