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DRV8461SPWPR Datasheet(PDF) 105 Page - Texas Instruments |
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DRV8461SPWPR Datasheet(HTML) 105 Page - Texas Instruments |
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105 / 117 page ![]() 9 Thermal Considerations 9.1 Thermal Pad Thermal pad of both DDW and PWP packages is attached at bottom of device to improve the thermal capability of the device. The thermal pad has to be soldered with a very good coverage on PCB in order to deliver the power specified in the datasheet. Refer to the Layout Guidelines section for more details. 9.2 PCB Material Recommendation FR-4 Glass Epoxy material with 2 oz. (70 μm) copper on both top and bottom layer is recommended for improved thermal performance and better EMI margin (due to lower PCB trace inductance). www.ti.com DRV8461 SLOSE98 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 105 Product Folder Links: DRV8461 |
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