ADM4850 to ADM4857

Data Sheet

Rev. F | Page 8 of 16

Figure 5. ADM4850/ADM4852/ADM4853, 8-Lead LFCSP, Pin Configuration

Table 9. ADM4850/ADM4852/ADM4853, 8-Lead LFCSP, Pin Function Descriptions

Pin No.

Mnemonic

Description

1

RO

Receiver Output. When RO is enabled and (A − B) ≥ −30 mV, RO is high. When RO is enabled and (A − B) ≤ −200 mV,

RO is low.

2

RE

Receiver Output Enable. A low level on RE enables the receiver output (RO). A high level on RE places RO into a high

impedance state.

3

DE

Driver Output Enable. A high level on DE enables the driver differential outputs (A and B). A low level places the

driver differential outputs into a high impedance state.

4

DI

Driver Input. When the driver is enabled, a logic low on DI forces A low and B high, whereas a logic high on DI

forces A high and B low.

5

GND

Ground.

6

A

Noninverting Receiver Input A/Noninverting Driver Output A.

7

B

Inverting Receiver Input B/Inverting Driver Output B.

8

V

CC

5 V Power Supply.

EPAD

Exposed Pad. The exposed paddle on the underside of the package must be soldered to the ground plane to

increase the reliability of the solder joints and to maximize the thermal capability of the package.

Figure 6. ADM4854/ADM4855/ADM4856/ADM4857, 8-Lead SOIC, Pin Configuration

Table 10. ADM4854/ADM4855/ADM4856/ADM4857, 8-Lead SOIC, Pin Function Descriptions

Pin No.

Mnemonic

Description

1

V

CC

5 V Power Supply.

2

RO

Receiver Output. When RO is enabled and (A − B) ≥ −30 mV, RO is high. When RO is enabled and (A − B) ≤ −200 mV,

RO is low.

3

DI

Driver Input. When the driver is enabled, a logic low on DI forces Y low and Z high, whereas a logic high on DI forces

Y high and Z low.

4

GND

Ground.

5

Y

Noninverting Driver Output.

6

Z

Inverting Driver Output.

7

B

Inverting Receiver Input.

8

A

Noninverting Receiver Input.

NOTES

1. THE EXPOSED PADDLE ON THE UNDERSIDE

OF THE PACKAGE SHOULD BE SOLDERED

TO THE GROUND PLANE TO INCREASE THE

RELIABILITY OF THE SOLDER JOINTS AND

TO MAXIMIZE THE THERMAL CAPABILITY OF

THE PACKAGE.

RO

RE

DE

DI

B

VCC

ADM4850/ADM4852/ADM4853

A

GND

3

4

1

2

6

5

8

7

TOP VIEW

(Not to Scale)

VCC 1

A

8

GND

4

Y

5

ADM4854/

ADM4855/

ADM4856/

ADM4857

TOP VIEW

(Not to Scale)

RO

2

B

7

DI

Z

6

3