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SIO1049 Datasheet(PDF) 6 Page - Microsemi Corporation |
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SIO1049 Datasheet(HTML) 6 Page - Microsemi Corporation |
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6 / 6 page ![]() Super I/O with LPC Interface, with IrDA and Microsoft® Windows® MCE Consumer IR Support Revision 0.35 (05-17-06) 6 SMSC SIO1049 PRODUCT PREVIEW Package Outline Notes: 1. Controlling Unit: millimeter. 2. Tolerance on the true position of the leads is ± 0.035 mm maximum. 3. Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25 mm per side. D1 and E1 dimensions determined at datum plane H. 4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane. 5. Details of pin 1 identifier are optional but must be located within the zone indicated. Figure 3 64 Pin STQFP Package Outline, 7X7X1.4 Body, 2 MM Footprint Table 1 64 Pin STQFP Package Parameters MIN NOMINAL MAX REMARKS A ~ ~ 1.60 Overall Package Height A1 0.05 ~ 0.15 Standoff A2 1.35 1.40 1.45 Body Thickness D 8.80 9.00 9.20 X Span D1 6.80 7.00 7.20 X body Size E 8.80 9.00 9.20 Y Span E1 6.80 7.00 7.20 Y body Size H 0.09 ~ 0.20 Lead Frame Thickness L 0.45 0.60 0.75 Lead Foot Length L1 ~ 1.00 REF. ~ Lead Length e 0.40 Basic Lead Pitch 0o ~7o Lead Foot Angle W 0.13 0.18 0.23 Lead Width ccc ~ ~ 0.08 Coplanarity |
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