Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Product Dimensions

Packaging:

3000 pcs. per reel.

AB

C

D

Model

Min.

Max.

Min.

Max.

Min.

Max.

Min.

MF-USMF005

3.00

3.43

2.35

2.80

0.80

1.1

0.30

(0.118)

(0.135)

(0.093)

(0.110)

(0.031)

(0.043)

(0.012)

MF-USMF010

3.00

3.43

2.35

2.80

0.80

1.1

0.30

(0.118)

(0.135)

(0.093)

(0.110)

(0.031)

(0.043)

(0.012)

MF-USMF020

3.00

3.43

2.35

2.80

0.80

1.1

0.30

(0.118)

(0.135)

(0.093)

(0.110)

(0.031)

(0.043)

(0.012)

MF-USMF035

3.00

3.43

2.35

2.80

0.55

0.85

0.30

(0.118)

(0.135)

(0.093)

(0.110)

(0.022)

(0.033)

(0.012)

MF-USMF050

3.00

3.43

2.35

2.80

0.55

0.85

0.30

(0.118)

(0.135)

(0.093)

(0.110)

(0.022)

(0.033)

(0.012)

MF-USMF075

3.00

3.43

2.35

2.80

0.55

0.85

0.30

(0.118)

(0.135)

(0.093)

(0.110)

(0.022)

(0.033)

(0.012)

MF-USMF110

3.00

3.43

2.35

2.80

0.55

0.85

0.30

(0.118)

(0.135)

(0.093)

(0.110)

(0.022)

(0.033)

(0.012)

MF-USMF150

3.00

3.43

2.35

2.80

0.40

0.85

0.30

(0.118)

(0.135)

(0.093)

(0.110)

(0.016)

(0.033)

(0.012)

MM

(INCHES)

UNIT =

Terminal material:

Electroless Ni under immersion Au

Termination pad solderability:

Standard Au finish:

Meets ANSI/J-STD-002 Category 2.

Recommended Storage:

40 °C max./70 % RH max.

A

B

C

Top and Bottom View

Side View

D

Recommended Pad Layout

2.5 ± 0.1

(.098 ± .004)

2.0 ± 0.1

(.079 ± .004)

1.0 ± 0.05

(.039 ± .002)

1.0 ± 0.05

(.039 ± .002)

160–220

300

250

200

150

100

50

0

10–20

120

Preheating

Soldering

Cooling

Time (seconds)

Notes:

• MF-USMF models cannot be wave soldered.

• If reflow temperatures exceed the recommended profile,

devices may not meet the performance requirements.

• Compatible with Pb and Pb-free solder reflow profiles.

Solder Reflow Recommendations