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ADC34RF52 Datasheet(PDF) 95 Page - Texas Instruments

Part # ADC34RF52
Description  ADC34RF52 Quad Channel 14-bit 1.5-GSPS RF Sampling Data Converter
PDF  105 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

ADC34RF52 Datasheet(HTML) 95 Page - Texas Instruments

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8.5 Layout
8.5.1 Layout Guidelines
There are several critical signals which require specific care during board design:
1. Analog input and clock signals
• Traces should be as short as possible and vias should be avoided where possible to minimize impedance
discontinuities.
• Traces should be routed using loosely coupled 100-Ω differential traces.
• Differential trace lengths should be matched as close as possible to minimize phase imbalance and HD2
degradation.
2. Digital JESD204B output interface
• Traces should be routed using tightly coupled 100-Ω differential traces.
3. Power and ground connections
• Provide low resistance connection paths to all power and ground pins.
• Use power and ground planes instead of traces.
• Avoid narrow, isolated paths which increase the connection resistance.
• Use a signal/ground/power circuit board stackup to maximize coupling between the ground and power
plane.
8.5.2 Layout Example
The following screen shot shows the top layer of the ADC34RF52 EVM.
• The input signal traces are routed as differential signals on the top layer avoiding vias. Care is taken
to maintain symmetry between positive and negative input with matched trace length to minimize phase
imbalance.
Figure 8-11 shows the layout example for 1x and 2x averaging configuration
• JESD204B output interface lanes are routed differential and length matched
• Bypass caps are close to the power pins on the top layer avoiding vias.
JESD204B Lanes
Tightly coupled traces
Analog Inputs on top layer –
symmetric differen al
rou ng
Figure 8-11. Layout example: top layer of the EVM
www.ti.com
ADC34RF52
SBASAI7 – MARCH 2023
Copyright © 2023 Texas Instruments Incorporated
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