CD4585BMS

Rev X.00

Page 8 of 8

Jan 13, 2017

CD4585BMS

FIGURE 9. TYPICAL SPEED CHARACTERISTICS OF A 12-BIT COMPARATOR

Chip Dimensions and Pad Layout

FIGURE 8. TYPICAL DYNAMIC POWER DISSIPATION AS A FUNCTION OF CLOCK INPUT FREQUENCY

Typical Performance Characteristics (Continued)

8

6

4

2

CLOCK INPUT FREQUENCY (fIN) (kHz)

0.1

8

6

4

2

10

AMBIENT TEMPERATURE (TA) = +25oC

SUPPLY VOLTAGE (VDD) = 15V

10V

10V

5V

8

6

4

2

102

8

6

4

2

103

8

6

4

2

104

8

6

4

2

1

8

6

4

2

10

8

6

4

2

102

8

6

4

2

103

104

CL = 50pF

CL = 15pF

A4

A5

A6

A7

B4

B5

B6

B7

(A > B)OUT

(A = B)OUT

(A < B)OUT

A0

A1

A2

A3

(A > B)IN

(A = B)IN

(A < B)IN

CD4585BMS

B0

B1

B2

B3

CD4585BMS

A8

A9

A10 A11

B8

B9

B10 B11

CD4585BMS

VDD

VDD

VDD

tp TOTAL = tp (COMPARE)

INPUTS

+ 2 x tp (CASCADE)

INPUTS

, AT VDD = 10V

Dimensions in parenthese are in millimeters and are

derived from the basic inch dimensions as indicated.

Grid graduations are in mils (10-3 inch).

METALLIZATION: Thickness: 11k

Å 14kÅ, AL.

PASSIVATION: 10.4kÅ - 15.6k

Å, Silane

BOND PADS: 0.004 inches X 0.004 inches MIN

DIE THICKNESS: 0.0198 inches - 0.0218 inches