HIP0045

FN4047 Rev 12.00

Page 3 of 10

Apr 1999

Absolute Maximum Ratings

Thermal Information

Maximum Output Voltage, VOUT . . . . . . . . . . . . . . . . . . .-0.7 to VOC

Peak Output Load Current, ILOAD . . . . . As Specified for ISC, ILIM

Continuous Output Load Current, IOUT (All 8 Outputs ON) . . . . 0.5A

Continuous Output Load Current, IOUT (Any one Output ON) . . 1A

Total Average Current, IOUT (All 8 Outputs) . . . . . . . . . . . . . . . 4.5A

Reverse Peak Current Drive, Any one Output, IRD; t 2ms . . . -3A

DC Logic Supply, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 7V

Input Voltage, All Inputs and Data Lines . . . . . . . -0.3 to VCC +0.3V

Operating Conditions

Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 125oC

Logic Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . 4.5V to 5.5V

Thermal Resistance (Typical, Note 6)

JA (oC/W) JC (oC/W)

PSOP Package . . . . . . . . . . . . . . . . . .

40

2

Maximum Junction Temperature, TJ . . . . . . . . . . . . . . . . . . . .150oC

Maximum Storage Temperature Range, TSTG . . . . -55oC to 150oC

Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .265oC

Die Characteristics

Back Side Potential . . . . . . . . . . . . . . . . . . .V- (GND Pin, Heat Sink)

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the

device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE:

6.

JA Rated with standard PC Board, JC rated with infinite heat sink.

Electrical Specifications

VCC = 4.5V to 5.5V, TA = -40oC to 125oC, Unless Otherwise Specified

PARAMETER

SYMBOL

TEST CONDITIONS

MIN

TYP

MAX

UNITS

Standby Current, No Load

ICCO

No Load

-

-

5

mA

Supply Current, Full Load

ICC

All Outputs ON, 0.5A Load Per Output

-

-

5

mA

Output Clamping Voltage (Note 7)

VOC

ILOAD = 0.5A, Output Programmed OFF

45

-

62

V

Output Clamping Energy

EOC

1ms Single Pulse Width, TA = 25oC,

(Refer to Figure 4 for SOA)

20

45

-

mJ

Output Leakage Current 1 (Note 8)

IO LEAK1 VOUT = 25V, Outputs OFF

-

-

100

A

Output Leakage Current 2 (Note 8)

IO LEAK2 VOUT = 16V, Outputs OFF

-

-

100

A

Output Leakage Current 3 (Note 8)

IO LEAK3 VOUT = 16V, Outputs OFF, VCC = 1V

-

-

10

A

Drain-to-Source On Resistance, OUT0 - 7

rDSON

ILOAD = 0.5A; TJ = 150oC-

-

1.5



Output Capacitance

COUT

VOUT = 16V, f = 1MHz

-

-

20

pF

Turn-On Delay, OUT0, 1

td(ON)

RL = 500, VCE = 50% to VOUT = 0.9 x VBATT,

VIN0,1 = 50% to VOUT = 0.9 x VBATT,

VBATT = 16V

--

5

s

Turn-On Delay, OUT2 - 7

td(ON)

RL = 500, VCE = 50% to VOUT = 0.9 x VBATT,

VBATT = 16V

--

10

s

Turn-Off Delay

td(OFF)

RL = 500, VCE = 50% to VOUT = 0.1 x VBATT,

VIN0,1 = 50% to VOUT = 0.9 x VBATT,

VBATT = 16V

--

10

s

Turn-On Voltage Slew-Rate, OUT2 - 7

For VOUT = 90% to 30% of VBATT; VBATT = 16V,

RL = 500

-0.7

3.5

V/

s

Turn-On Voltage Slew-Rate, OUT0, 1

For VOUT = 90% to 30% of VBATT; VBATT = 16V,

RL = 500

-2

10

V/

s

Turn-Off Voltage Slew-Rate, OUT0 - 7

For VOUT = 30% to 90% of VBATT; VBATT = 16V,

RL = 500

-2

10

V/

s

Turn-Off Voltage Slew-Rate, OUT0 - 7

For VOUT = 30% to 80% of VOC;

VBATT = 0.9 x VOC, RL = 500

-2

15

V/

s

FAULT PARAMETERS

Reverse Current Drive, OUT0 - 7

IRD

-500

-

-

mA

Reverse Voltage Drop, OUT0 - 7

VRD

IOUT = -3A, t 2ms

-1.5

-

-

V

ICC during Reverse Current Drive

ICC

IOUT = -3A, t 2ms

-

-

100

mA

dVON1

dt

-------------------

dVON2

dt

-------------------

dVOFF1

dt

----------------------

dVOFF2

dt

----------------------