FN4034 Rev 0.00

Page 7 of 7

December 1996

HIP0050

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M24.3 (JEDEC MS-013-AD ISSUE C)

24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

A

0.0926

0.1043

2.35

2.65

-

A1

0.0040

0.0118

0.10

0.30

-

B

0.013

0.020

0.33

0.51

9

C

0.0091

0.0125

0.23

0.32

-

D

0.5985

0.6141

15.20

15.60

3

E

0.2914

0.2992

7.40

7.60

4

e

0.05 BSC

1.27 BSC

-

H

0.394

0.419

10.00

10.65

-

h

0.010

0.029

0.25

0.75

5

L

0.016

0.050

0.40

1.27

6

N24

24

7



0o

8o

0o

8o

-

Rev. 0 12/93

NOTES:

1. Symbols are defined in the “MO Series Symbol List” in Section 2.2

of Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate

burrs. Mold flash, protrusion and gate burrs shall not exceed

0.15mm (0.006 inch) per side.

4. Dimension “E” does not include interlead flash or protrusions. Inter-

lead flash and protrusions shall not exceed 0.25mm (0.010 inch)

per side.

5. The chamfer on the body is optional. If it is not present, a visual in-

dex feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater

above the seating plane, shall not exceed a maximum value of

0.61mm (0.024 inch)

10. Controlling dimension: MILLIMETER. Converted inch dimensions

are not necessarily exact.

INDEX

AREA

E

D

N

12

3

-B-

0.25(0.010)

C A

M

B S

e

-A-

L

B

M

-C-

A1

A

SEATING PLANE

0.10(0.004)

h x 45o

C

H

µ

0.25(0.010)

B

M

M



Small Outline Plastic Packages (SOIC)