6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

Supply voltage

–0.5

7

V

IIK

Input clamp current(2)

VI < 0 or VI > VCC

±20

mA

IOK

Output clamp current(2)

VO < 0 or VO > VCC

±20

mA

IO

Continuous output current

VO = 0 to VCC

±35

mA

ICC

Continuous current through VCC or GND

±70

mA

TJ

Junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated

under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/

JEDEC JS-001(1)

±4000

V

Charged-device model (CDM), per ANSI/ESDA/

JEDEC JS-002(2)

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Supply voltage

2

6

V

VI

Input voltage

0

VCC

V

VO

Output voltage

0

VCC

V

TA

Ambient temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

SN74HCS573

UNIT

RKS (VQFN)

DGS (VSSOP)

20 PINS

20 PINS

RθJA

Junction-to-ambient thermal resistance

83.2

130.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

82.6

68.7

°C/W

RθJB

Junction-to-board thermal resistance

57.4

85.4

°C/W

ΨJT

Junction-to-top characterization parameter

14.5

10.5

°C/W

ΨJB

Junction-to-board characterization parameter

56.4

85.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

40.0

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

SN74HCS573

SCLS876A – OCTOBER 2021 – REVISED DECEMBER 2022

www.ti.com

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