Data Sheet PG10025EJ02V0DS

6

NE960R2 SERIES

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered under the following recommended conditions.

For soldering methods and

conditions other than those recommended below, contact your nearby sales office.

Soldering Method

Soldering Conditions

Condition Symbol

Partial Heating

Peak temperature (pin temperature)

: 350

°C or below

Soldering time (per pin of device)

: 3 seconds or less

Maximum chlorine content of rosin flux (% mass) : 0.2 % (Wt.) or below

HS350-P3

Caution Do not use different soldering methods together (except for partial heating).

CHIP HANDLING

DIE ATTACHMENT

Die attach can be accomplished with a Au-Sn (300

±10°C) performs in a forming gas environment. Epoxy die

attach is not recommended.

BONDING

Gate and drain bonding wires should be minimum length, semi-hard gold wire (3 to 8 % elongation) 30 microns or

less in diameter.

Bonding should be performed with a wedge tip that has a taper of approximately 15 %.

Die attach and bonding time should be kept to a minimum. As a general rule, the bonding operation should be

kept within a 280

°C_5 minute curve. If longer periods are required, the temperature should be lowered.

PRECAUTIONS

The user must operate in a clean, dry environment.

The chip channel is glassivated for mechanical protection only and does not preclude the necessity of a clean

environment.

The bonding equipment should be periodically checked for sources of surge voltage and should be properly

grounded at all times. In fact, all test and handling equipment should be grounded to minimize the possibilities of

static discharge.