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MPC603EEC/D Datasheet(PDF) 21 Page - NXP Semiconductors

Part # MPC603EEC/D
Description  PowerPC 603e™ RISC Microprocessor Family: PID6-603e Hardware Specifications
PDF  32 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

MPC603EEC/D Datasheet(HTML) 21 Page - NXP Semiconductors

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PID6-603e Hardware Specifications, Rev 2
21
1.7.1.2 Mechanical Dimensions of the CQFP Package
Figure 11 shows the mechanical dimensions of the Motorola CQFP package.
Figure 11. Mechanical Dimensions of the Wire-Bond CQFP Package
*Reduced pin count shown for clarity. 60 pins per side
Min.
Max.
A
30.86 31.75
B
34.6 BSC
C
3.75
4.15
D
0.5 BSC
E
0.18
0.30
F
3.10
3.90
G
0.13
0.175
H
0.45
0.55
J
0.25
–
AA
1.80 REF
AB
0.95 REF
θ12°
6°
θ21°
7°
R
0.15 REF
–H–
AB
θI
R
R
AA
θ2
H
Pin 240
C
A
B
Pin 1
DE
*Not to scale
G
F
J
Die
Wire Bonds
Ceramic Body
Alloy 42 Leads
Notes: 1. BSC—Between Standard Centers.
2. All measurements in mm.
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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