Nexperia

BAT854SW

40 V, 200 mA Schottky barrier dual diode

13. Soldering

solder lands

solder resist

occupied area

solder paste

sot323_fr

2.65

2.35 0.6

(3×)

0.5

(3×)

0.55

(3×)

1.325

1.85

1.3

3

2

1

Dimensions in mm

Fig. 5. Reflow soldering footprint for SC-70 (SOT323)

sot323_fw

3.65 2.1

1.425

(3×)

4.6

09

(2×)

2.575

1.8

solder lands

solder resist

occupied area

preferred transport

direction during soldering

Dimensions in mm

Fig. 6. Wave soldering footprint for SC-70 (SOT323)

BAT854SW

All information provided in this document is subject to legal disclaimers.

© Nexperia B.V. 2023. All rights reserved

Product data sheet

4 January 2023

5 / 8