uPI Semiconductor Corp., http://www.upi-semi.com

Rev. F03, File Name: uP6281-DS-F0300

uP6281

9

Note

1.Package Outline Unit Description:

BSC: Basic. Represents theoretical exact dimension or dimension target

MIN: Minimum dimension specified.

MAX: Maximum dimension specified.

REF: Reference. Represents dimension for reference use only. This value is not a device specification.

TYP. Typical. Provided as a general value. This value is not a device specification.

2.Dimensions in Millimeters.

3.Drawing not to scale.

4.These dimensions no not include mold flash or protrusions. Mold flash or protrusions shell not exceed 0.15mm.

Package Information

PSOP-8 Package

0.32 - 0.52

4.80 - 5.00

0.18 - 0.25

0.40 - 0.90

0.70

10

± 0.

1.27

10

± 0.

1.27 BSC

Recommended Solder Pad Layout

1.80 - 2.30

2.20

10

± 0.

3.81 BSC

0.05 - 0.25

1.75 MAX

1.45 - 1.60