September 14, 2006 S72MS-P_00_01

S72MS-P based MCP/PoP Products

7

Da ta

Sh e e t

(Adv a n ce

In f o r m ation)

5.

Physical Dimensions

5.1

TLK137—137-ball Fine-Pitch Ball Grid Array (FBGA) 13 x 11 mm Package

3606 \ 16-038.43 \ 9.14.06

PACKAGE

TLK 137

JEDEC

N/A

D x E

13.00 mm x 11.00 mm

PACKAGE

SYMBOL

MIN

NOM

MAX

NOTE

A

---

---

1.20

PROFILE

A1

0.17

---

---

BALL HEIGHT

A2

0.79

---

0.96

BODY THICKNESS

D

13.00 BSC.

BODY SIZE

E

11.00 BSC.

BODY SIZE

D1

10.40 BSC.

MATRIX FOOTPRINT

E1

7.20 BSC.

MATRIX FOOTPRINT

MD

14

MATRIX SIZE D DIRECTION

ME

10

MATRIX SIZE E DIRECTION

n

137

BALL COUNT

Øb

0.35

0.40

0.45

BALL DIAMETER

eE

0.80 BSC.

BALL PITCH

eD

0.80 BSC

BALL PITCH

SD SE

0.40 BSC.

SOLDER BALL PLACEMENT

G5,H5,H6

DEPOPULATED SOLDER BALLS

NOTES:

1.

DIMENSIONING AND TOLERANCING METHODS PER

ASME Y14.5M-1994.

2.

ALL DIMENSIONS ARE IN MILLIMETERS.

3.

BALL POSITION DESIGNATION PER JEP95, SECTION 4.3,

SPP-010.

4.

e REPRESENTS THE SOLDER BALL GRID PITCH.

5.

SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"

DIRECTION.

SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE

"E" DIRECTION.

n IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS

FOR MATRIX SIZE MD X ME.

6

DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL

DIAMETER IN A PLANE PARALLEL TO DATUM C.

7

SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A

AND B AND DEFINE THE POSITION OF THE CENTER SOLDER

BALL IN THE OUTER ROW.

WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE

OUTER ROW SD OR SE = 0.000.

WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE

OUTER ROW, SD OR SE = e/2

8.

"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED

BALLS.

9

A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK

MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.