October 6, 2005 S75WS-N_02_A2

S75WS-N Based MCPs

11

Pr el im i n a r y

5.5

Physical Dimensions – FND115 – Fine Pitch Ball Grid Array 11 x 13 mm

3524 \ 16-038.19 \ 10.5.05

PACKAGE

FND 115

JEDEC

N/A

D x E

13.00 mm x 11.00 mm

PACKAGE

SYMBOL

MIN

NOM

MAX

NOTE

A

---

---

1.40

PROFILE

A1

0.17

---

---

BALL HEIGHT

A2

0.98

---

1.15

BODY THICKNESS

D

13.00 BSC.

BODY SIZE

E

11.00 BSC.

BODY SIZE

D1

10.40 BSC.

MATRIX FOOTPRINT

E1

7.20 BSC.

MATRIX FOOTPRINT

MD

14

MATRIX SIZE D DIRECTION

ME

10

MATRIX SIZE E DIRECTION

n

115

BALL COUNT

b

0.35

0.40

0.45

BALL DIAMETER

eE

0.80 BSC.

BALL PITCH

eD

0.80 BSC

BALL PITCH

SD SE

0.40 BSC.

SOLDER BALL PLACEMENT

A3-A8,B3-B8,C1,N3-N8,P3-P8 DEPOPULATED SOLDER BALLS

NOTES:

1.

DIMENSIONING AND TOLERANCING METHODS PER

ASME Y14.5M-1994.

2.

ALL DIMENSIONS ARE IN MILLIMETERS.

3.

BALL POSITION DESIGNATION PER JEP95, SECTION

4.3, SPP-010.

4.

e REPRESENTS THE SOLDER BALL GRID PITCH.

5.

SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"

DIRECTION.

SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E"

DIRECTION.

n IS THE NUMBER OF POPULTED SOLDER BALL

POSITIONS FOR MATRIX SIZE MD X ME.

6

DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL

DIAMETER IN A PLANE PARALLEL TO DATUM C.

7

SD AND SE ARE MEASURED WITH RESPECT TO

DATUMS A AND B AND DEFINE THE POSITION OF THE

CENTER SOLDER BALL IN THE OUTER ROW.

WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS

IN THE OUTER ROW SD OR SE = 0.000.

WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS

IN THE OUTER ROW, SD OR SE = e/2

8.

"+" INDICATES THE THEORETICAL CENTER OF

DEPOPULATED BALLS.

9.

A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER

OR INK MARK, METALLIZED MARK INDENTATION OR

OTHER MEANS.

Ø

0.08 C

C

SIDE VIEW

6

115X

A1

0.15

M C

MC

AB

0.08

b

7

SE

E1

D1

eD

10

8

7

9

5

4

2

1

3

eE

6

PIN A1

CORNER

A

DC

E

F

G

H

J

K

7

L

M

P

N

0.20 C

BOTTOM VIEW

SD

B

A

D

E

C

0.15

(2X)

B

0.15

(2X)

TOP VIEW

9

CORNER

PIN A1

A2

A

INDEX MARK

C