D2-71083-LR datasheet(32/33 Pages) RENESAS

32 / 33 page

D2-6 Family Audio SOC

FN7838 Rev.4.00

Page 32 of 33

Mar. 19, 2019

Package Outline Drawing

128X b

(L1)

0 3

128

SEATING PLANE

0.080 Y

DETAIL F

124X

0.25 GAUGE

PLATING

0.05

0.07

Y T-U

0.2 H T-U Z

0.2 Y T-U Z

PLANE

PIN 1

Q128.14x14

128 LEAD LOW PLASTIC QUAD FLATPACK

PACKAGE .4 MM PITCH (LQFP)

SYMBOL

MILLIMETERS

NOTES

MIN

NOM

MAX

1.60

0.05

0.15

1.35

1.40

1.45

0.13

0.16

0.23

0.13

0.19

0.09

0.20

0.09

0.16

16 BSC

14 BSC

16 BSC

14 BSC

0.45

0.60

0.75

1.00 REF

0.08

0.20

---

00°

3.5°

7°

0°

11°

12°

13°

11°

12°

13°

128

e0.40 BSC

Rev. 1 7/11

NOTES:

1. Dimensions are in millimeters. Dimensions in ( ) for

Reference Only.

2. Dimensions and tolerances per AMSEY14.5M-1994.

3. Dimensions D1 and E1 are excluding mold protrusion.

Allowable protrusion is 0.25 per side. Dimensions D1

and E1 are exclusive of mold mismatch and deter-

mined by datum plane H.

4. Dimension b does not include dambar protrusion.

Allowable dambar protrusion shall not cause the lead

width to exceed the maximum b dimension by more

than 0.08mm. Dambar cannot be located at the lower

radius or the foot. Minimum space between protrusion

and an adjacent lead is 0.07 mm.

For the most recent package outline drawing, see Q128.14x14.

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