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TMF8701 Datasheet(PDF) 58 Page - ams AG |
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TMF8701 Datasheet(HTML) 58 Page - ams AG |
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58 / 66 page  Datasheet, Public Page 57 [v2-00] 2023-Feb-21 Document Feedback TMF8701 − Soldering & Storage Information Floor Life The module has been assigned a moisture sensitivity level of MSL 3. As a result, the floor life of devices removed from the moisture barrier bag is 168 hours from the time the bag was opened, provided that the devices are stored under the following conditions: • Floor Life: 168 hours • Ambient Temperature: <30°C • Relative Humidity: <60% If the floor life or the temperature/humidity conditions have been exceeded, the devices must be rebaked prior to solder reflow or dry packing. Rebaking Instructions When the shelf life or floor life limits have been exceeded, rebake at 50°C for 12 hours. |
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