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GWIXP420BBT Datasheet(PDF) 88 Page - Intel Corporation

Part # GWIXP420BBT
Description  Intel짰 IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor
PDF  134 Pages
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Manufacturer  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation

GWIXP420BBT Datasheet(HTML) 88 Page - Intel Corporation

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Intel® IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor
March 2005
Datasheet
88
Document Number: 252479, Revision: 005
5.4.6
MDIO DC Parameters
5.4.7
SDRAM Bus DC Parameters
5.4.8
Expansion Bus DC Parameters
Table 30.
MDIO DC Parameters
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
Notes
VIH
Input-high voltage
2.0
V
VIL
Input-low voltage
0.8
V
VOH
Output-high voltage
IOUT = -4 mA
2.4
V
VOL
Output-low voltage
IOUT = 4 mA
0.4
V
IIL
Input-leakage current
0 < VIN < VCCP
-10
10
µA
CIN
Input-pin capacitance
5
pF
1
CINMDIO
Input-pin capacitance
5
pF
1
Note:
1.
These values are typical values seen by the manufacturing process and are not tested.
Table 31.
SDRAM Bus DC Parameters
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
Notes
VIH
Input-high voltage
2.0
V
1
VIL
Input-low voltage
0.8
V
2
VOH
Output-high voltage
IOUT = -4 mA
2.4
V
VOL
Output-low voltage
IOUT = 4 mA
0.4
V
IIL
Input-leakage current
0 < VIN < VCCP
-5
5
µA
IOL
Output-leakage
current
0 < VIN < VCCP
-5
5
µA
CINCLK
Input-pin capacitance
4
pF
3
CIO
I/O-pin capacitance
5
pF
3
Notes:
1.
VIH overshoot: VIH (MAX) = VCCP + 2 V for a pulse width < 3 ns, and the pulse width cannot be greater
than one third of the cycle rate.
2.
VIL undershoot: VIL (MIN) = -2 V for a pulse width < 3 ns cannot be exceeded.
3.
These values are typical values seen by the manufacturing process and are not tested.
Table 32.
Expansion Bus DC Parameters (Sheet 1 of 2)
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
Notes
VIH
Input-high voltage
2.0
V
VIL
Input-low voltage
0.8
V
VOH
Output-high voltage
IOUT = -4 mA
2.4
V
1
Notes:
1.
Test conditions were a 70 pF load to ground.
2.
These values are typical values seen by the manufacturing process and are not tested.



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