Data Sheet G10239EJ4V0DS

9

μ PC1943,1944

RECOMMENDED SOLDERING CONDITIONS

The

μPC1943, 1944 should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales

representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

Type of Surface Mount Device

μPC1943T, 1944T : POWER MINI MOLD (SOT-89) (SC-62)

Process

Conditions

Symbol

Infrared ray reflow

Peak temperature: 235

°C or below (Package surface temperature),

Reflow time: 30 seconds or less (at 210

°C or higher),

Maximum number of reflow processes: 3 times.

IR35-00-3

VPS

Peak temperature: 215

°C or below (Package surface temperature),

Reflow time: 40 seconds or less (at 200

°C or higher),

Maximum number of reflow processes: 2 times.

VP15-00-2

Partial Heating Method

Pin temperature: 350

°C or below,

Heat time: 3 seconds or less (per each side of the device).

P350

μPC1943T-AZ, 1944T-AZ : POWER MINI MOLD (SOT-89) (SC-62)

Process

Conditions

Symbol

Infrared ray reflow

Peak temperature: 260

°C or below (Package surface temperature),

Reflow time: 60 seconds or less (at 220

°C or higher),

Maximum number of reflow processes: 3 times.

IR60-00-3

Partial Heating Method

Pin temperature: 350

°C or below,

Heat time: 3 seconds or less (per each side of the device).

P350

Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.

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