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UPC1944J Datasheet(PDF) 12 Page - Renesas Technology Corp

Part # UPC1944J
Description  BIPOLAR ANALOG INTEGRATED CIRCUIT
PDF  13 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

UPC1944J Datasheet(HTML) 12 Page - Renesas Technology Corp

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Data Sheet G10239EJ4V0DS
10
μ PC1943,1944
μPC1944GR : 8PIN PLASTIC SOP (5.72 mm (225))
Process
Conditions
Symbol
Infrared ray reflow
Peak temperature: 235
°C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210
°C or higher),
Maximum number of reflow processes: 3 time.
IR35-00-3
VPS
Peak temperature: 215
°C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200
°C or higher),
Maximum number of reflow processes: 1 time.
VP15-00-1
Wave soldering
Solder temperature: 260
°C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time.
WS60-00-1
Partial Heating Method
Pin temperature: 350
°C or below,
Heat time: 3 seconds or less (per each side of the device).
P350
μPC1944GR-A : 8PIN PLASTIC SOP (5.72 mm (225))
Process
Conditions
Symbol
Infrared ray reflow
Peak temperature: 260
°C or below (Package surface temperature),
Reflow time: 60 seconds or less (at 220
°C or higher),
Maximum number of reflow processes: 3 time.
IR60-00-3
Wave soldering
Solder temperature: 260
°C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time.
WS60-00-1
Partial Heating Method
Pin temperature: 350
°C or below,
Heat time: 3 seconds or less (per each side of the device).
P350
Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.
Type of Through-hole Device
μPC1944J, 1944J-A : 3PIN PLASTIC SIP (TO-92)
Process
Conditions
Symbol
Wave soldering (only to leads)
Solder temperature: 260
°C or below, Flow time: 10 seconds or less.
Maximum number of flow processes: 1 time,
WS60-00-1
Partial Heating Method
Pin temperature: 350°C or below,
Heat time: 3 seconds or less (per each pin).
P350
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
REFERENCE DOCUMENTS
Review of Quality and Reliability Handbook Information
C12769E
Semiconductor Device Mount Manual
http://www.necel.com/pkg/en/mount/index.html
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