MP2192

– 2A, SYNCHRONOUS STEP-DOWN CONVERTER WITH 25µA IQ

MP2192 Rev. 1.0

MonolithicPower.com

3

5/12/2021

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PIN FUNCTIONS

Pin #

Name

Description

A1

GND

Power ground.

A2

OUT

Output sense. OUT is the voltage power rail and input sense pin for the output voltage. Use

an output capacitor to reduce the output voltage ripple.

B1

SW

Output switching node. SW is the drain of the internal high-side P-channel MOSFET.

Connect the inductor to SW to complete the converter.

B2

EN

On/off control.

C1

VIN

Supply voltage. The MP2192 operates from an unregulated input between 2.5V and 5.5V.

A decoupling capacitor is required to prevent large voltage spikes from appearing at the

input.

C2

FB

Feedback. An external resistor divider connected from the output to GND, then tapped to

the FB pin, sets the output voltage.

ABSOLUTE MAXIMUM RATINGS (1)

Supply voltage (VIN) .................................... 6.5V

VSW................................ -0.3V (-5V for <10ns) to

+6.5V (+10V for <10ns)

All other pins ................................-0.3V to +6.5V

Junction temperature ................................150°C

Lead temperature .....................................260°C

Continuous power dissipation (TA = 25°C)

(2) (4)

................................................................. 1.39W

Storage temperature ................ -65°C to +150°C

ESD Ratings

Human body model (HBM) ....................

±2000V

Charged device model (CDM).. +1000V, -1500V

Recommended Operating Conditions (3)

Supply voltage (VIN) ........................2.5V to 5.5V

Operating junction temp (TJ) .... -40°C to +125°C

Thermal Resistance

θJA θJC(TOP)

EVL2192-C-00A (4)

……...........90……30…°C/W

WLCSP-6 (5)

………………...141……..2…°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature, TJ (MAX), the junction-to-

ambient

thermal

resistance,

θ

JA,

and

the

ambient

temperature, TA. The maximum allowable continuous power

dissipation at any ambient temperature is calculated by PD

(MAX) = (TJ (MAX) - TA) / θJA. Exceeding the maximum

allowable power dissipation may produce an excessive die

temperature, and the device may go into thermal shutdown.

Internal thermal shutdown circuitry protects the device from

permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on the EVL2192-C-00A evaluation board, 2-layer

PCB.

5) Measured on JESD51-7, 4-layer PCB.

The value of θ

JA given

in this table is only valid for comparison with other packages

and cannot be used for design purposes. These values are

calculated in accordance with JESD51-7, and simulated on a

specified

JEDEC

board.

They

do

not

represent

the

performance obtained in an actual application.