4

AM26C32

SLLS104L – DECEMBER 1990 – REVISED OCTOBER 2018

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Copyright © 1990–2018, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential voltages, are with respect to the network ground terminal.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCC

Supply voltage(2)

7

V

VI

Input voltage

A or B inputs

–11

14

V

G or G inputs

–0.5

VCC + 0.5

VID

Differential input voltage

–14

14

V

VO

Output voltage

–0.5

VCC + 0.5

V

IO

Output current

±25

mA

Tstg

Storage temperature

-65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±3000

V

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±2000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Supply voltage

4.5

5

5.5

V

VIH

High-level input voltage

2

Vcc

V

VIL

Low-level input voltage

0

0.8

V

VIC

Common-mode input voltage

-7

+7

V

IOH

High-level output current

–6

mA

IOL

Low-level output current

6

mA

TA

Operating free-air temperature

AM26C32C

0

70

°C

AM26C32I

–40

85

AM26C32Q

–40

125

AM26C32M

–55

125

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1)

AM26C32

UNIT

D (SOIC)

N (PDIP)

NS (SO)

PW (TSSOP)

16 PINS

16 PINS

16 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

73

67

64

108

°C/W