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STD10P10F6 Datasheet(PDF) 3 Page - STMicroelectronics |
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STD10P10F6 Datasheet(HTML) 3 Page - STMicroelectronics |
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3 / 16 page ![]() 2 Electrical characteristics TC = 25 °C unless otherwise specified. Table 3. On /off states Symbol Parameter Test conditions Min. Typ. Max. Unit V(BR)DSS Drain-source breakdown voltage VGS = 0 V, ID = -250 μA -100 V IDSS Zero gate voltage drain current VGS = 0 V, VDS = -100 V -1 µA VGS = 0 V, VDS = -100 V, TC = 125 °C(1) -10 µA IGSS Gate-body leakage current VDS = 0 V, VGS = ±20 V ±100 nA VGS(th) Gate threshold voltage VDS = VGS, ID = -250 µA -2 -4 V RDS(on) Static drain-source on- resistance VGS = -10 V, ID = -5 A 0.136 0.18 Ω 1. Defined by design, not subject to production test. Table 4. Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit Ciss Input capacitance VDS = -80 V, f = 1 MHz, VGS = 0 V - 864 - pF Coss Output capacitance - 45 - pF Crss Reverse transfer capacitance - 25 - pF Qg Total gate charge VDD = -80 V, ID = -10 A, VGS = -10 V (see Figure 13. Gate charge test circuit) - 16.5 - nC Qgs Gate-source charge - 3.5 - nC Qgd Gate-drain charge - 3.8 - nC Table 5. Switching on/off (inductive load) Symbol Parameter Test conditions Min. Typ. Max. Unit td(on) Turn-on delay time VDD = -80 V, ID = -5 A, RG = 4.7 Ω, VGS = -10 V (see Figure 12. Switching times test circuit for resistive load) - 10.5 - ns tr Rise time - 4.8 - ns td(off) Turn-off delay time - 24 - ns tf Fall time - 4.5 - ns Table 6. Source drain-diode Symbol Parameter Test conditions Min. Typ. Max. Unit VSD (1) Forward on voltage ISD = -5 A, VGS = 0 V - -1.1 V trr Reverse recovery time ISD = -10 A, di/dt = 100 A/µs, VDD = -80 V (see Figure 14. Test circuit for inductive load switching and diode recovery times) - 26.5 ns Qrr Reverse recovery charge - 36.5 nC IRRM Reverse recovery current - -2.7 A 1. Pulsed: pulse duration = 300 µs, duty cycle 1.5% STD10P10F6 Electrical characteristics DS10343 - Rev 3 page 3/16 |
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