UJA1069 datasheet(62/64 Pages) PHILIPS

62 / 64 page

UJA1069_2

Preliminary data sheet

Rev. 02 — 5 March 2007

62 of 64

NXP Semiconductors

UJA1069

LIN fail-safe system basis chip

For further information on temperature proﬁles, refer to Application Note

AN10365

“Surface mount reﬂow soldering description”.

14. Revision history

MSL: Moisture Sensitivity Level

Fig 29. Temperature proﬁles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Table 29.

Revision history

Document ID

Release date

Data sheet status

Change notice

Supersedes

UJA1069_2

20070305

Preliminary data sheet

UJA1069_1

Modiﬁcations:

• The format of this data sheet has been redesigned to comply with the new identity guidelines of

NXP Semiconductors.

• Legal texts have been adapted to the new company name where appropriate.

• Section 6: symbols corrected; replaced symbol tRSTN(ext) with tRSTN(CLT) and with tRSTN(CHT);

replaced tINTNH with tINTN

• Table 11: table note added

• Table 25: updated pin SDO conditions and pin LIN, parameter ILIL value

• Figure 24 and Figure 26 updated

• Soldering information updated

• Added Test information, see Section 11 “Test information”

• Added Figure 23

• Added a second condition row to ILIH in Table 25

• Changed in Table note [2] of Table 26 “VBAT14” to “VBAT42”

UJA1069_1

20051222

Objective data sheet

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