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CD3206BB Datasheet(PDF) 3 Page - NXP Semiconductors

Part # CD3206BB
Description  9-bit latched/registered/pass-thru Futurebus transceiver
PDF  18 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

CD3206BB Datasheet(HTML) 3 Page - NXP Semiconductors

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Philips Semiconductors
Product specification
FB2031
9-bit latched/registered/pass-thru Futurebus+ transceiver
1995 May 25
3
DESCRIPTION
The FB2031 is a 9-bit latched/registered
transceiver featuring a latched, registered or
pass-thru mode in either the A-to-B or B-to-A
direction. The FB2031 is intended to provide
the electrical interface to a high performance
wired-OR bus.
The TTL-level side (A port) has a common
I/O. The common I/O, open collector B port
operates at BTL signal levels. The logic
element for data flow in each direction is
controlled by two mode select inputs (SEL0
and SEL1). A “00” configures latches in both
directions. A “10” configures thru mode in
both directions. A “01” configures register
mode in both directions. A “11” configures
register mode in the A-to-B direction and
latch mode in the B-to-A direction.
When configured in the buffer mode, the
inverse of the input data appears at the
output port. In the register mode, data is
stored on the rising edge of the appropriate
clock input (LCAB or LCBA). In the latch
mode, clock pins serve as transparent-Low
latch enables. Regardless of the mode, data
is inverted from input to output.
The 3-State A port is enabled by asserting a
High level on OEA. The B port has two output
enables, OEB0 and OEB1. Only when OEB0
is High and OEB1 is Low is the output
enabled.
When either OEB0 is Low or OEB1 is High,
the B port is inactive and is pulled to the level
of the pullup voltage. New data can be
entered in the register and latched modes or
can be retained while the associated outputs
are in 3-State (A port) or inactive (B port).
The B-port drivers are Low-capacitance open
collectors with controlled ramp and are
designed to sink 100mA. Precision band gap
references on the B-port insure very good
noise margins by limiting the switching
threshold to a narrow region centered at
1.55V.
The B-port interfaces to “Backplane
Transceiver Logic” (see the IEEE 1194.1 BTL
standard). BTL features low power
consumption by reducing voltage swing (1V
p-p, between 1V and 2V) and reduced
capacitive loading by placing an internal
series diode on the drivers. BTL also
provides incident wave switching, a necessity
for high performance backplanes.
Output clamps are provided on the BTL
outputs to further reduce switching noise.
The “VOH” clamp reduces inductive ringing
effects during a Low-to-High transition. The
“VOH” clamp is always active. The other
clamp, the “trapped reflection” clamp, clamps
out ringing below the BTL 0.5V VOL level.
This clamp remains active for approximately
100ns after a High-to-Low transition.
To support live insertion, OEB0 is held Low
during power on/off cycles to insure glitch-
free B port drivers. Proper bias for B port
drivers during live insertion is provided by the
BIAS V pin when at a 5V level while VCC is
Low. The BIAS V pin is a low current input
which will reverse-bias the BTL driver series
Schottky diode, and also bias the B port
output pins to a voltage between 1.62V and
2.1V. This bias function is in accordance with
IEEE BTL Standard 1194.1. If live insertion is
not a requirement, the BIAS V pin should be
tied to a VCC pin.
The LOGIC GND and BUS GND pins are
isolated inside the package to minimize noise
coupling between the BTL and TTL sides.
These pins should be tied to a common
ground external to the package.
Each BTL driver has an associated BUS
GND pin that acts as a signal return path and
these BUS GND pins are internally isolated
from each other. In the event of a ground
return fault, a “hard” signal failure occurs
instead of a pattern dependent error that may
be infrequent and impossible to troubleshoot.
As with any high power device, thermal
considerations are critical. It is
recommended that airflow (300Ifpm)
and/or thermal mounting be used to
ensure proper junction temperature.
PACKAGE THERMAL CHARACTERISTICS
PARAMETER
CONDITION
52-PIN PLASTIC QFP
θja
Still air
80
°C/W
θja
300 Linear feet per minute air flow
58
°C/W
θjc
Thermally mounted on one side to heat sink
20
°C/W
PIN DESCRIPTION
SYMBOL
PIN NUMBER
TYPE
NAME AND FUNCTION
A0 – A8
50, 52, 2, 4, 6, 8, 10, 12, 14
I/O
BiCMOS data inputs/3-State outputs (TTL)
B0 – B8
40, 38, 36, 34, 32,
30, 28, 26, 24
I/O
Data inputs/Open Collector outputs, High current drive (BTL)
OEB0
46
Input
Enables the B outputs when High
OEB1
45
Input
Enables the B outputs when Low
OEA
47
Input
Enables the A outputs when High
BUS GND
25, 27, 29, 31, 33,
35, 37, 39, 41
GND
Bus ground (0V)
LOGIC GND
51, 1, 3, 5, 7, 9, 11, 13
GND
Logic ground (0V)
VCC
23, 43, 49
Power
Positive supply voltage
BIAS V
48
Power
Live insertion pre-bias pin
BG VCC
17
Power
Band Gap threshold voltage reference
BG GND
19
GND
Band Gap threshold voltage reference ground
SEL0
20
Input
Mode select
SEL1
15
Input
Mode select
LCAB
18
Input
A to B clock/latch enable (transparent latch when Low)
LCBA
16
Input
B to A clock/latch enable (transparent latch when Low)
TMS
42
Input
Test Mode Select (optional, if not implemented then no connect)
TCK
44
Input
Test Clock (optional, if not implemented then no connect)
TDI
22
Input
Test Data In (optional, if not implemented then no connect)
TDO
21
Output
Test Data Out (optional, if not implemented then shorted to TDI)



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