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PCF8578U/2 Datasheet(PDF) 36 Page - NXP Semiconductors |
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PCF8578U/2 Datasheet(HTML) 36 Page - NXP Semiconductors |
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36 / 44 page ![]() 1998 Sep 08 36 Philips Semiconductors Product specification LCD row/column driver for dot matrix graphic displays PCF8578 15 CHIP DIMENSIONS AND BONDING PAD LOCATIONS Fig.28 Bonding pad locations. Chip area: 14.93 mm2. Bonding pad dimensions: 120 µm × 120 µm. The numbers given in the small squares refer to the pad numbers. MBH589 VDD 4.88 mm 3.06 mm VLCD V2 OSC V3 V4 V5 C39 C38 C37 C36 C35 R5 54 R6 R7 R8/C8 R9/C9 R10/C10 R11/C11 R12/C12 R13/C13 R14/C14 R15/C15 R16/C16 R17/C17 R18/C18 R19/C19 R20/C20 R21/C21 R22/C22 x PCF8578 y 0 0 1 2 3 4 5 6 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 |
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