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MPC8313CVRAFF Datasheet(PDF) 79 Page - Freescale Semiconductor, Inc |
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MPC8313CVRAFF Datasheet(HTML) 79 Page - Freescale Semiconductor, Inc |
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79 / 88 page ![]() MPC8313E PowerQUICC™ II Pro Processor Hardware Specifications, Rev. 0 Freescale Semiconductor 79 Thermal Accurate thermal design requires thermal modeling of the application environment using computational fluid dynamics software which can model both the conduction cooling and the convection cooling of the air moving through the application. Simplified thermal models of the packages can be assembled using the junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More detailed thermal models can be made available on request. Heat sink Vendors include the following list: Aavid Thermalloy 603-224-9988 80 Commercial St. Concord, NH 03301 Internet: www.aavidthermalloy.com Alpha Novatech 408-749-7601 473 Sapena Ct. #12 Santa Clara, CA 95054 Internet: www.alphanovatech.com International Electronic Research Corporation (IERC) 818-842-7277 413 North Moss St. Burbank, CA 91502 Internet: www.ctscorp.com Table 63. Heat Sinks and Junction-to-Case Thermal Resistance of MPC8313E (TEPBGAII) Heat Sink Assuming Thermal Grease Air Flow 35x35 mm TBGA Junction-to-Ambient Thermal Resistance AAVID 30x30x9.4 mm Pin Fin Natural Convection 10.7 AAVID 30x30x9.4 mm Pin Fin 1 m/s 6.2 AAVID 30x30x9.4 mm Pin Fin 2 m/s 5.3 AAVID 31x35x23 mm Pin Fin Natural Convection 8.1 AAVID 31x35x23 mm Pin Fin 1 m/s 4.4 AAVID 31x35x23 mm Pin Fin 2 m/s 3.7 Wakefield, 53x53x25 mm Pin Fin Natural Convection 5.4 Wakefield, 53x53x25 mm Pin Fin 1 m/s 3.2 Wakefield, 53x53x25 mm Pin Fin 2 m/s 2.4 MEI, 75x85x12 no adjacent board, extrusion Natural Convection 6.4 MEI, 75x85x12 no adjacent board, extrusion 1 m/s 3.8 MEI, 75x85x12 no adjacent board, extrusion 2 m/s 2.5 MEI, 75x85x12 mm, adjacent board, 40 mm Side bypass 1 m/s 2.8 |
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