GaAs DPDT Switch

DC - 6.0 GHz

MASW6030G

M/A-COM Inc. and its affiliates reserve the right to make changes to the

product(s) or information contained herein without notice. M/A-COM makes

no warranty, representation or guarantee regarding the suitability of its

products for any particular purpose, nor does M/A-COM assume any liability

whatsoever arising out of the use or application of any product(s) or

information.

• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macom.com for additional data sheets and product information.

V3

3

RoHS

Compliant

Mounting

The MASW6030G is back-metallized with Pd/Ni/Au

(100/1,000, 10,000 Å) metallization.

It can be die-

mounted with AuSn eutectic preforms or with thermally

conductive epoxy. The package surface should be clean

and flat before attachment.

Eutectic Die Attach:

A.

A 80/20 gold/tin preform is recommended with a

work surface temperature of approximately 255°C

and a tool temperature of 265°C. When not 90/10

nitrogen/hydrogen

gas

is

applied,

tool

tip

temperature should be approximately 290°C.

B.

DO NOT expose the MASW6030G to a temperature

greater than 320°C for more than 20 seconds. No

more than 3 seconds for scrubbing should be

required for attachment.

Epoxy Die Attach:

A.

Apply a minimum amount of epoxy and place the

MASW6030G into position. A thin epoxy fillet should

be visible around the perimeter of the chip.

B.

Cure

epoxy

per

manufacturer’s

recommended

schedule.

C.

Electrically conductive epoxy may be used by is not

required.

Wire Bonding

A.

Ball or wedge with 1.0 mil diameter pure gold wire.

Thermosonic wirebonding with a nominal stage

temperature of 150°C and a ball bonding force of 40

to 50 grams or wedge bonding force o1 18 to 22

grams is recommended. Ultrasonic energy and time

should be adjusted to the minimum levels achieve

reliable wirebonds.

B.

Wirebonds should be started on the chip and

terminated on the package.

Handling Precautions

Permanent damage to the MASW6030G may occur if the

following precautions are not adhered to:

A.

Cleaniness—MASW6030G should be handled in a

clean environment. DO NOT attempt to clean unit

after the MASW6030G is installed.

B.

Static Sensitivity—All chip handling equipment and

personnel should be DC grounded.

C.

Transient—Avoid

instrument

and

power

supply

transients while bias is applied to the MASW6030G.

Use shielded signal and bias cables to minimize

inductive pick-up.

D.

Bias—Apply voltage to either of the complementary

control ports only when the other is grounded. No

port should be allowed to “float”.

E.

General Handling—It is recommended that the

MASW6030G chip be handled along the long side of

the die with a sharp pair of bent tweezers. DO NOT

touch the surface of the chip with fingers or

tweezers.

20

30

40

50

60

70

80

01

23

45

67

Frequency (GHz)

Isolation @ 25°C

1.0

1.2

1.4

1.6

1.8

2.0

01

23

45

67

Frequency (GHz)

VSWR @ 25°C