5.4 Thermal Information for Single Channel

THERMAL METRIC (1)

OPA310-Q1

OPA310S-Q1

UNIT

DBV

(SOT-23)

DCK

(SC70)

DBV

(SOT-23)

DCK

(SC70)

5 PINS

5 PINS

6 PINS

6 PINS

RθJA

Junction-to-ambient thermal resistance

211.5

214.6

190.7

195.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

109.4

110.0

110.5

122.9

°C/W

RθJB

Junction-to-board thermal resistance

77.8

60.7

70.8

55.5

°C/W

ψJT

Junction-to-top characterization parameter

45.2

32.1

47.4

38.3

°C/W

ψJB

Junction-to-board characterization parameter

77.5

60.4

70.5

55.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

n/a

n/a

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

5.5 Thermal Information for Dual Channel

THERMAL METRIC (1)

OPA2310-Q1

D

(SOIC)

DGK

(VSSOP)

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

139.0

187.7

RθJC(top)

Junction-to-case (top) thermal resistance

81.2

78.1

RθJB

Junction-to-board thermal resistance

82.4

109.5

ψJT

Junction-to-top characterization parameter

31.3

17.9

ψJB

Junction-to-board characterization parameter

81.6

107.9

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

5.6 Thermal Information for Quad Channel

THERMAL METRIC (1)

OPA4310-Q1

UNIT

D

(SOIC)

PW

(TSSOP)

14 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

101.5

128.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

57.8

58.7

°C/W

RθJB

Junction-to-board thermal resistance

58.0

71.4

°C/W

ψJT

Junction-to-top characterization parameter

20.9

13.0

°C/W

ψJB

Junction-to-board characterization parameter

57.6

70.8

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

OPA310-Q1

SBOSAI0A – DECEMBER 2023 – REVISED MAY 2024

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